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FR4 Multilayer PCB HDI Laser Blind Buried Via PCB Board Fabrication

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Guangzhou Highleap Electronic Co.,Ltd.

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Name: FR4 Multilayer PCB HDI Laser Blind Buried Via PCB Board Fabrication
Brand: HighLeap
Price: 1 USD

Brand Name : HighLeap

Model Number : PCB Board

Certification : ISO9001/Iso14001/CE/ROHS

Place of Origin : China

MOQ : 1pcs

Price : USD 1-30 piece

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 10000 piece per week

Delivery Time : 1-15 working days

Packaging Details : Vacuum Package

Product name : Printed Circuit Board....

Copper Thickness : 0.5oz-12oz....

Application : Electronics Device....

Surface Finishing : HASL\OSP\immersion Gold\ENIG....

Certificate : CE/ISO/ROHS....

Base Material : FR4+ROGERS/ROGERS+ROGERS...

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Multilayer PCB		Special Tech
Place of Origin:	China	1.Impedance 2.Via Filling 3.PFH,Backdrill 4.Mix Finishes 5.Cave 6.Heatsink 7.ENEPIG
Brand Name:	Highleap
Application Segment:	Auto,Industrial,Medical,DataCom,Consumer
Layer Count:	4~50L
Matierial:	FR4 (Tg130~Tg170)
Board Thickness(mm):	0.6mm~10.0mm
Copper Thickness(oz):	Hoz~3oz
Size(mm):	5mm~1200mm
Min. LW/LS(mm):	0.1/0.1
Min. Hole(mm):	0.25
Solder Mask:	Green, Yellow, Blue, Black, White...
Surface Finish:	ENIG,OSP,HASL,Imm Tin,Imm Silver...
Certificate:	RoHS/ISO9001/ISO14001
Service:	OEM

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